🛠 Chips

Jul.2024
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[Samsung 28nm] HAB-1

  • Reconfigurable Bridge between Host and integrated CNN Accelerator
  • Runtime bridge data transfer scheduling reconfigure support
  • 2-channel MPI interfaces for accelerator control
  • Extra MPI external slot for scalable accelerator expansion
Dec.2023
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[SK Key 130nm] InfiniTYle

  • Arm Cortex-M0+ compatible custom ISA
  • Custom SIMD instruction support
  • Virtual scalable flash memory using off-chip QSPI interface
  • 2-channel custom Tile-SoC interface for accelerator control
Dec.2023
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[SK Key 130nm] Tile-SoC

  • Tile-connected scalable CNN accelerator
  • Connect in all four directions (up, down, left, and right) for scalable extension
  • Accelerator compute utilization-aware load allocation by host (= InfiniTYle)
Feb.2022
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[Confidential] DSI3 IP module for Ultrasonic Sensor

  • Tri-level current decoding link layer
  • Discovery mode support for daisy chain address assignment
  • Receive voltage command from master / transfer current response to slave
  • Periodic Data Collection Mode (PDCM) support
Jan.2022
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[Confidential] SENT IP module for Force Sensor

  • Synchronization/Calibration pulse support
  • Fast channel – Secure Message / High Speed Format support
  • Slow channel – Short Serial Message / Enhanced Serial Message support
  • Variable length pause pulse support
Apr.2021
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[DB HiTek 180nm] I2S IP module for AMBA peripheral

  • APB DMA support
  • External MCK, SCK, LRCK support
  • Master/Slave and TX/RX support
  • Small error LRCK frequency generation (22.05KHz, 44.1KHz, 48KHz, 96KHz, 192KHz)
  • 2-types format support (Aligned, I2S)
  • Mono channel support
  • Interrupts support